LED Backlight Production Process

LED backlight and CCFL backlight are basically the same in structure, the main difference is that LED is a point light source, and CCFL is a line light source.In the long run, LED backlighting technology as a replacement for the existence of technology products will certainly be gradually popularized.

The following is a preliminary understanding of the production process of LED backlight:

A. cleaning: ultrasonic cleaning of PCB or LED wire rack and drying.

B. Mounting: after the bottom electrode of the LED chip (large wafer) is prepared with silver glue, the expanded chip (large wafer) is placed on the spinel table. Under the microscope, spinel pens are used to install the pipe cores one by one on the corresponding welding plate of PCB or LED support.

C. Pressure welding: connect the electrode to the LED core with aluminum wire or gold wire welding machine to be the lead for current injection.LED directly installed on the PCB, generally using aluminum wire welding machine.(white light top-led requires gold wire welding machine)

D. Packaging: epoxy is used to protect LED core and welding line through glue dispensing.Glue dispensing on PCB board has strict requirements on colloidal shape after curing, which is directly related to the output brightness of backlight products.The process also takes on the task of lighting up fluorescent powder (white LED).

E. Welding: if the backlight source is smd-led or other encapsulated LED, the LED shall be welded to the PCB board before assembly process.

F. Film cutting: all kinds of diffusion films and reflective films required by backlight source are cut by punch die.

G. Assembly: according to the requirements of the drawings, all kinds of materials of the backlight shall be manually installed in the correct position.

H. Test: check whether the photoelectric parameters of the backlight source and the uniformity of light output are good.

I. packaging: packaging and warehousing of finished products as required.